Friday, July 22, 2011

Electronic Failure Analysis Handbook Review

Electronic Failure Analysis Handbook
Average Reviews:

(More customer reviews)
After I read this book, I passed it to my Engineers, and afterwhich I never have a chance to access it anymore, as both my Engineers just won't let go!
This is indeed "THE BIBLE" for Failure Analysis. It covers most of the techniques needed for each type of FA, like X-ray imaging, SAM, Thermal imaging, Metallography, Chemical Characterization, SEM/EDX, and Electronic Failures. The best of it all is that in Part 2, it is organized in terms of equipment techniques; in part 3, it is organized in terms of products, like PCB, PCBA, connection, component, etc. As such it give you the flexibility either go to Part 2 and learn about how and what types of failure analysis a particular equipment can perform, or go to Part 3 and find out the sequence of which equipments is to used first for a particular failure mode.
However, I need to highlight that the though there are tons of photos in the book, the quality of the photos need lots of improvement. Many a times, it takes me long time to figure out what's in the photos. Maybe some highlights or markings at the particular spot of interest in the comparison of the photos would help some novice readers to appreciate better

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The definitive, all-in-one, cost-saving guide to electronic failure analysis--from the field's top experts

Still digging for the latest developments and techniques in electronic failure analysis? The leading-edge methods for slashing product failure rates are all right here in this complete, comprehensive source. You'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation, and liability avoidance.

Absolutely essential to anyone concerned with electronic product development and testing, the Handbook gives you ready-to-use, insider information on state-of-the-art EFA techniques; the how's and why's of electronic failures; failure prediction; warranty cost control; liability-costs and other issues.


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